RKD Engineering: NanoPrep
BENEFITS:
- 1 µm resolution
- All Metric Lead Screws and Stepper Motors.
- 5 µm hard stop with each step of the Z motor.
- Floating Tool with adjustable pressure for Silicon Removal
- USB Digital Drop Gauge computer interface
- ± 1.5 µm accuracy for computer stops
FEATURES:
- Touch keypad interface
- Full process programmability
- System automation of thinning and polishing processes (except tool change)
- Minimal operator interaction required
- ± 1.5 µm accuracy over entire sample
OPTIONAL CAPABILITY
- Upgrade to µMill functionality
Download Product Brochure - or view here
NANOPREP is a precision CNC for the backside grinding and polishing in silico. NanoPrep can be programmed for all of the steps necessary to thin and polish the backside of a die with minimal operator intervention. There are no slow and complicated manual stage adjustments to enter die position. There are no complex azimuthal stage corrections to compensate for die tilt within a package, such corrections if necessary are just software prompted tweaks to the stage. Because NanoPrep is a fully functional mini - CNC all you need to do is to enter die size into software and start die grinding.
NanoPreps OS enables fast, easy sample preparation that requires only minimal operator intervention. You can prepare samples quickly and easily for FIB Circuit Edit, NIR and Photon Emission Microscopy (frontside and backside)
Keyed sample mounting enables samples to be removed from NanoPrep for inspection and thickness measurement, using Reltrons NIR Microscope System - the ICS-1000 NIR (see Reltron Microscopy), and returned for further thinning and polishing - no realignment necessary!
The system has the ability to store 256 text-based recipes that can include some, or all of the the following parameters.
MAKE A HOLDING FIXTURE
The Holding Fixture is designed for accurate centering and rotation of the sample (Fixed Head Operation)
REMOVE HEAT SINK
For removal of heat sink or any die covering on flipchips. (Fixed Head Operation)
EXPOSE THE DIE
For Plastic and Die Flag removal (Fixed Head Operation)
ALIGN SAMPLE
Nine-Point automated calibration to set flatness(Floating Tool Operation)
GRIND SILICON TO DEPTH
Programmed Process with automated stop (Floating Tool Operation)
LAP 1
15µm programmed polished (Floating Tool Operation)
POLISH 1
3µm programmed polished (Floating Tool Operation)
POLISH 2
0.5µm programmed polished (Floating Tool Operation)